| PART |
Description |
Maker |
| 0942422318 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole, PCT, Vertical, 18 Circuit, White
MOLEX Connector
|
Molex Electronics Ltd.
|
| A-70280-0115 0010897720 010-89-7720 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row
|
Molex Electronics Ltd.
|
| 71764-0122 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
| MMB1901R480 MM-B1901-R480 36512-0196 0365120196 |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, Through Hole, 0.4μm (16μ) Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4渭m (16渭") Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4楼矛m (16楼矛") Selective Gold (Au), 48 Circuits
|
Molex Electronics Ltd.
|
| 0022282038 22-28-2038 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Backwalls Remove
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
| 0022282048 22-28-2048 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Backwalls Remove
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
| 0022282022 22-28-2022 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87911-5411 0879115411 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0022284104 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284103 22-28-4103 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 22-28-4154 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 15 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
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